Samsung Turns to Rival TSMC for a Key Part of Nvidia's Next-Generation AI Memory
Samsung Electronics will use TSMC's 3-nanometre manufacturing process to produce the base die for Nvidia's next-generation custom high-bandwidth memory, the Seoul Economic Daily reported on Sunday, in a story relayed by Reuters. The arrangement would mark the first time Samsung has worked with the Taiwanese contract chipmaker at the HBM manufacturing stage, and it signals how far Nvidia's push for a standardized memory design now reaches into its suppliers' factories.